CLEARFIL SE BOND 2 by Kuraray, 6ml + 5ml

Description

CLEARFIL™ SE BOND 2 – Advanced Two-Step Self-Etch Adhesive

CLEARFIL™ SE BOND 2 represents the next generation of the gold-standard CLEARFIL™ SE BOND. This two-step self-etch adhesive delivers improved bond strength and, when combined with CLEARFIL™ DC Activator, offers dual-cure capability for broader clinical applications.

Key Features & Benefits

• Enhanced bond strength – 21% higher dentin bond strength compared to the previous CLEARFIL™ SE BOND, thanks to new photoinitiators from Kuraray Noritake Dental.
• Dual-cure versatility – Mix with CLEARFIL™ DC Activator for dual-cure use, enabling cementation of indirect restorations and resin-reinforced fiber posts.
• Simple application – Apply PRIMER actively for 20 seconds, evaporate solvent with gentle air, then apply BOND and light-cure. For dual-cure, mix activator with BOND before application.
• Advanced polymerization technology – Optimal combination of adhesive monomer 10-MDP (Kuraray Noritake Dental patent) and exclusive polymerization technology ensures high degree of monomer polymerization and long-lasting adhesion.

Clinical Indications

• Direct adhesive restorations
• Cementation of indirect restorations (when used dual-cure)
• Resin-reinforced fiber post cementation (when used dual-cure)

Key Specifications

Application Steps

1. Apply PRIMER actively for 20 seconds.
2. Evaporate solvent with gentle or indirect air stream (gentle dry).
3. Apply BOND and spread gently with microbrush or brush without thinning excessively.
4. Light-cure with a lamp. For dual-cure use, mix CLEARFIL™ DC Activator with BOND before application.

Note: For dual-cure applications, always use CLEARFIL™ DC Activator as directed. Store at room temperature and avoid direct light exposure.

Order CLEARFIL™ SE BOND 2 today for reliable, high-strength adhesion in your daily practice.